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| MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MTP8N50E/D Designer'sTM Data Sheet TMOS E-FET.TM Power Field Effect Transistor N-Channel Enhancement-Mode Silicon Gate This high voltage MOSFET uses an advanced termination scheme to provide enhanced voltage-blocking capability without degrading performance over time. In addition, this advanced TMOS E-FET is designed to withstand high energy in the avalanche and commutation modes. This new energy efficient design also offers a drain-to-source diode with a fast recovery time. Designed for low voltage, high speed switching applications in power supplies, converters, PWM motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional safety margin against unexpected voltage transients. * Robust High Voltage Termination * Avalanche Energy Specified * Source-to-Drain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode * Diode is Characterized for Use in Bridge Circuits * IDSS and VDS(on) Specified at Elevated Temperature MTP8N50E TMOS POWER FET 8.0 AMPERES 500 VOLTS RDS(on) = 0.8 OHM (R) D G S CASE 221A-06, Style 5 TO-220AB MAXIMUM RATINGS (TJ = 25C unless otherwise noted) Rating Drain-to-Source Voltage Drain-to-Gate Voltage (RGS = 1.0 MW) Gate-to-Source Voltage - Continuous Gate-to-Source Voltage - Non-repetitive (tp 10 ms) Drain Current -- Continuous @ TC = 25C Drain Current -- Continuous @ TC = 100C Drain Current -- Single Pulse (tp 10 ms) Total Power Dissipation @ TC = 25C Derate above 25C Operating and Storage Temperature Range Single Pulse Drain-to-Source Avalanche Energy - STARTING TJ = 25C (VDD = 25 Vdc, VGS = 10 Vdc, PEAK IL = 8.0 Apk, L = 16 mH, RG = 25 W) Thermal Resistance - Junction-to-Case - Junction-to-Ambient Maximum Lead Temperature for Soldering Purposes, 1/8 from Case for 5 sec. Symbol VDSS VDGR VGS VGSM ID ID IDM PD TJ, Tstg EAS Value 500 500 20 40 8.0 5.0 32 125 1.0 - 55 to 150 510 Unit Vdc Vdc Vdc Vpk Adc Apk Watts W/C C mJ RqJC RqJA TL 1.0 62.5 260 C/W C This document contains information on a new product. Specifications and information herein are subject to change without notice. E-FET and Designer's are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc. REV 2 (c) Motorola TMOS Motorola, Inc. 1996 Power MOSFET Transistor Device Data 1 MTP8N50E ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted) Characteristic OFF CHARACTERISTICS Drain-to-Source Breakdown Voltage (VGS = 0 Vdc, ID = 250 Adc) Temperature Coefficient (Positive) Zero Gate Voltage Drain Current (VDS = 500 Vdc, VGS = 0 Vdc) (VDS = 400 Vdc, VGS = 0 Vdc, TJ = 125C) Gate-Body Leakage Current (VGS = 20 Vdc, VDS = 0 Vdc) ON CHARACTERISTICS (1) Gate Threshold Voltage (VDS = VGS, ID = 250 Adc) Threshold Temperature Coefficient (Negative) Static Drain-to-Source On-Resistance (VGS = 10 Vdc, ID = 4.0 Adc) Drain-to-Source On-Voltage (VGS = 10 Vdc) (ID = 8.0 Adc) (ID = 4.0 Adc, TJ = 125C) Forward Transconductance (VDS = 15 Vdc, ID = 4.0 Adc) DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance Transfer Capacitance SWITCHING CHARACTERISTICS (2) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Gate Charge (see Figure 8) ( (VDS = 400 Vdc, ID = 8 0 Ad , Vd , 8.0 Adc, VGS = 10 Vdc) (Rgo + C1 = 9.1 W) C17n 9 1 td(on) tr td(off) tf QT Q1 Q2 Q3 SOURCE-DRAIN DIODE CHARACTERISTICS Forward On-Voltage (IS = 8.0 Adc, VGS = 0 Vdc) (IS = 8.0 Adc, VGS = 0 Vdc, TJ = 125C) Reverse Recovery Time ( (IS = 8 0 Ad , VGS = 0 Vdc, 8.0 Adc, Vd , dIS/dt = 100 A/ms) Reverse Recovery Stored Charge INTERNAL PACKAGE INDUCTANCE Internal Drain Inductance (Measured from the drain lead 0.25 from package to center of die) Internal Source Inductance (Measured from the source lead 0.25 from package to source bond pad) (1) Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%. (2) Switching characteristics are independent of operating junction temperature. LD -- LS -- 7.5 -- 4.5 -- nH trr ta tb QRR VSD -- -- -- -- -- -- 1.2 1.1 320 179 141 3.0 2.0 -- -- -- -- -- ns Vdc -- -- -- -- -- -- -- -- 15 33 40 32 40 8.0 17 17.3 50 72 150 60 64 -- -- -- nC ns (VDS = 25 Vdc, VGS = 0 Vdc, Vdc Vdc f = 1.0 MHz) Ciss Coss Crss -- -- -- 1450 190 45.4 1680 246 144 pF VGS(th) 2.0 -- RDS(on) -- VDS(on) -- -- gFS 4.0 -- -- 5.0 -- 7.2 6.4 mhos 0.6 0.8 Vdc 2.8 6.3 4.0 -- Vdc mV/C Ohms V(BR)DSS 500 -- IDSS -- -- IGSS -- -- 100 -- -- 250 1000 -- 500 -- -- Vdc mV/C Symbol Min Typ Max Unit mAdc nAdc mC 2 Motorola TMOS Power MOSFET Transistor Device Data MTP8N50E TYPICAL ELECTRICAL CHARACTERISTICS 16 TJ = 25C I D, DRAIN CURRENT (AMPS) 8V 12 6V VGS = 10 V 7V I D, DRAIN CURRENT (AMPS) 16 14 12 10 8.0 100C 6.0 25C 4.0 TJ = -55C 2.0 0 0 12 2.0 4.0 6.0 8.0 10 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) 14 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VGS, GATE-TO-SOURCE VOLTAGE (VOLTS) 6.5 7.0 VDS 10 V 8.0 4.0 5V Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics R DS(on), DRAIN-TO-SOURCE RESISTANCE (OHMS) 1.6 1.4 1.2 1.0 0.8 25C 0.6 0.4 0.2 0 0 2.0 4.0 8.0 12 6.0 10 ID, DRAIN CURRENT (AMPS) -55C 14 16 VGS = 10 V TJ = 100C R DS(on), DRAIN-TO-SOURCE RESISTANCE (OHMS) 0.90 0.85 0.80 0.75 0.70 0.65 0.60 0.55 0 2.0 4.0 6.0 8.0 10 12 14 16 ID, DRAIN CURRENT (AMPS) VGS = 10 V 15 V TJ = 25C Figure 3. On-Resistance versus Drain Current and Temperature RDS(on) , DRAIN-TO-SOURCE RESISTANCE (NORMALIZED) Figure 4. On-Resistance versus Drain Current and Gate Voltage 2.5 VGS = 10 V ID = 8 A 100,000 VGS = 0 V 10,000 IDSS, LEAKAGE (nA) TJ = 125C 100C 1,000 2.0 1.5 1.0 100 25C 0.5 0 -50 10 1.0 -25 0 25 50 75 100 125 150 0 100 200 300 400 500 TJ, JUNCTION TEMPERATURE (C) VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) Figure 5. On-Resistance Variation with Temperature Figure 6. Drain-to-Source Leakage Current versus Voltage Motorola TMOS Power MOSFET Transistor Device Data 3 MTP8N50E TYPICAL ELECTRICAL CHARACTERISTICS 4000 VDS = 0 V C, CAPACITANCE (pF) 3000 Ciss VGS = 0 V TJ = 25C C, CAPACITANCE (pF) 10,000 VGS = 0 V Ciss 1,000 TJ = 25C 2000 Ciss Crss 1000 Crss -5.0 0 VGS VDS GATE-TO-SOURCE OR DRAIN-TO-SOURCE VOLTAGE (VOLTS) 5.0 10 15 20 25 Coss 100 Coss Crss 0 -10 10 10 100 DRAIN-TO-SOURCE VOLTAGE (VOLTS) 1000 Figure 8. High Voltage Capacitance Variation Figure 7. Capacitance Variation V GS, GATE-TO-SOURCE VOLTAGE (VOLTS) 12 QT 10 8.0 VGS 6.0 4.0 2.0 Q3 0 0 8.0 VDS 16 24 Qg, TOTAL GATE CHARGE (nC) 32 TJ = 25C ID = 8 A Q1 Q2 400 1000 TJ = 25C ID = 8 A VDD = 250 V VGS = 10 V t, TIME (ns) 300 200 100 V DS , DRAIN-TO-SOURCE VOLTAGE (VOLTS) 100 0 40 10 1.0 td(off) tr tf td(on) 10 RG, GATE RESISTANCE (OHMS) 100 Figure 9. Gate-to-Source and Drain-to-Source Voltage versus Total Charge Figure 10. Resistive Switching Time Variation versus Gate Resistance 8.0 TJ = 25C VGS = 0 V I D, DRAIN CURRENT (AMPS) 6.0 100 VGS = 20 V SINGLE PULSE TC = 25C 10 ms 100 ms 1.0 1 ms 10 ms dc RDS(on) LIMIT THERMAL LIMIT PACKAGE LIMIT 0.1 1.0 10 100 1000 I S , SOURCE CURRENT (AMPS) 10 4.0 2.0 0.1 0 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS) 0.01 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) Figure 11. Diode Forward Voltage versus Current Figure 12. Maximum Rated Forward Biased Safe Operating Area 4 Motorola TMOS Power MOSFET Transistor Device Data MTP8N50E 600 EAS , SINGLE PULSE DRAIN-TO-SOURCE AVALANCHE ENERGY (mJ) ID = 8 A 500 400 300 200 100 0 25 75 125 50 100 TJ, STARTING JUNCTION TEMPERATURE (C) 150 Figure 13. Maximum Avalanche Energy versus Starting Junction Temperature 1.0 r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE D = 0.5 0.2 0.1 0.1 0.05 0.02 0.01 SINGLE PULSE 0.01 0.0001 0.00001 0.001 0.01 t, TIME (seconds) 0.1 1.0 10 Figure 14. Thermal Response Motorola TMOS Power MOSFET Transistor Device Data 5 MTP8N50E PACKAGE DIMENSIONS -T- B 4 SEATING PLANE F T S C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. DIM A B C D F G H J K L N Q R S T U V Z INCHES MIN MAX 0.570 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.147 0.095 0.105 0.110 0.155 0.018 0.025 0.500 0.562 0.045 0.060 0.190 0.210 0.100 0.120 0.080 0.110 0.045 0.055 0.235 0.255 0.000 0.050 0.045 --- --- 0.080 MILLIMETERS MIN MAX 14.48 15.75 9.66 10.28 4.07 4.82 0.64 0.88 3.61 3.73 2.42 2.66 2.80 3.93 0.46 0.64 12.70 14.27 1.15 1.52 4.83 5.33 2.54 3.04 2.04 2.79 1.15 1.39 5.97 6.47 0.00 1.27 1.15 --- --- 2.04 Q 123 A U K STYLE 5: PIN 1. 2. 3. 4. GATE DRAIN SOURCE DRAIN H Z L V G D N R J CASE 221A-06 ISSUE Y Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 303-675-2140 or 1-800-441-2447 MfaxTM: RMFAX0@email.sps.mot.com - TOUCHTONE 602-244-6609 INTERNET: http://Design-NET.com JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 81-3-3521-8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298 6 MTP8N50E/D Motorola TMOS Power MOSFET Transistor Device Data |
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